I try to simulate creep in an electornic bga package under thermal cycling. The key to the right result will be the creep constants for the solder. All constants i found online are for the hyperbolic sine creep law. As far as I know solid works can only work with the Nortons creep law.
Can i somehow implement the hyperbolic sine creep law?
Is there any way to get the right creep constants for a common solder?
Or can i possibly calculate the norton creep constants with the given hyperbolic sine constants?
hi Christian,
Maybe this is usefull: (the article is attached in PDF)
S-018620
Deriving creep constants from creep curve data:
COSMOSWorks and COSMOSDesignSTAR use the Classical Power Law for Creep (Bailey-Norton law).
The creep strain at time t is : (see pdf)
where:
T = Temperature (Kelvin) (= input temperature + reference temperature + offset temperature)
CT = A material constant defining the creep temperature-dependency
C0, C1 and C2 are the three creep constants
The full article is available in pdf format, in the attachment tab of this Solution