I try to simulate creep in an electornic bga package under thermal cycling. The key to the right result will be the creep constants for the solder. All constants i found online are for the hyperbolic sine creep law. As far as I know solid works can only work with the Nortons creep law.
Can i somehow implement the hyperbolic sine creep law?
Is there any way to get the right creep constants for a common solder?
Or can i possibly calculate the norton creep constants with the given hyperbolic sine constants?