what do you want to learn in the analysis?
Thank you for your question--please see my response below:
My goal is to predict the response of the printed circuit board assembly to the SRS input. I need max board displacement, & eventually determine stresses in the component solder joints in the area of greatest board inflection. I would like to compare it against another analysis that I performed where the wax was solidified.
I have performed multiple sine sweeps in different axes of both scenarios (solidified wax and melted wax), so I have test data from about 20 Hz to 3000 Hz. I calibrated my solid wax analysis model to agree with the test data for the first few modal responses. I don't know how to accurately "tweak" the liquid wax model to agree with the test data. Can I apply a soft spring connecting all the exterior nodes of the encapsulated circuit board to the surrounding metallic structure, or is that not a good approximation? I can't model the water as a discrete part since the material model is so different from solids.
Do I need to analyze this with CFD in order to expect any reasonable results, or is there some way to come up with a justifiable boundary condition to represent the water without making assumptions that are not valid and could skew the eventual analysis results?
ccfd won't likely help. Spring seems like the best option. Otherwise a really really soft material.