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Thermal Load FEA question

Question asked by Daniel Genova on Aug 25, 2014
Latest reply on Aug 26, 2014 by Jared Conway

I am working on a project in which I need to find whether a silicone rubber, which encapsulates a copper wire which is soldered to a circuit board, exerts enough force, when thermally expanding, to cause a failure in the copper wire or solder. The model I made includes a solder piece(which has a long cylindical piece to symbolize its insertion into a PCB board), and long copper wire, and a block of the silicone rubber.   The silicone rubber is fixed on all sides except the top and the whole assembly changes from room temperature to 85C.  However, I am confused on how to define the several boundary conditions.  

1) For the thermal external load I applied it on every surface because the entire assembly eventually reaches 85C.  Should I instead have just applied it to the external surface?

2) For for fixtures I defined all sides of the rubber , except the top, as fixed as well as the cylindrical part of the solder where the Circuit board would be

3) For Connection's i bonded the copper wire to the rubber and the solder joint.


Are these boundary conditions correct for the problem I defined?

If the definition of the problem is too ambiguous let me know and I can try to rephrase it or provide more information.

I have attached the file.