Sure, so I've got a 6063 Aluminium heatsink, this includes the board on which the LED's and driver sit on (12v - 8W).
All surfaces are then joined together with some thermal glue 1.5 K/W.
The driver which produces the most heat has been tested in real life to reach around 80c with the current heatsink.
Although when setting up the analysis 8W of heat power showed very little heat so I increased it to 50w.
SW set up: Contact areas: 1.5 k/w
Convection: Coefficent 250 W/(m2K)
Ambient 300 K
Heat Power: 50 W
I'd expect the heat to transfer into the outer shell of the heatsink just like it would it real life.
The analysis shows a very abrupt heat transfer, perhaps dissipating before it gets a chance to reach the heatsink.
Once I am happy with the simulation I was then going to modify the geometry to try and increase heatflux into the outside thus reducing total temp of the driver and increasing product life time.
As for the software test, I haven't done any. I never though I should consider it not working properly, this is a pretty basic simulation.
It's also done pretty well with previous stress simlations, results which were tested on a physical model afterwards.
If it helps here's a picture of the product, as mentioned in a previous post the outerpart is shielded from radiations coming from the module;
