Hello,
I am having trouble accuratly modeling TO-247 packages in simulation. I was hoping to get some help on how best to set this up. My TO-247 package consists of three components, a copper case, a die(the transistor), and a plastic case. I modeled the die as silicon, the copper case as copper, and the plastic case as epoxy resin. For the insulator I used the manufactuer spec sheet to build a material (the spec sheet wasnt very good I had to leave a lot blank). I am still not getting accurate results. My prototype has far different values then simulation. I took a cross section of the temperature distribution and I found that the temp of my junction was the same temperature as my heat sink. I know this is not possible. Can anyone who has done this type of work before give me an accurate method for modeling this situtaion? I would much rather use the junction to case resistance, and insulator to heatsink resistance provided by the manufactuer then rely on material selection in simulation. I have upladed my heat sink model for extra clarification.
Thank you,
Travis
To do what you want for setup, get the electronics cooling module. He 2r input method does exactly what you want. Or convert the values and make your own 2r.
To understands why you sim may be different, you will have to elaborate on your test setup and conditions. The assumptions you think your analysis makes and some numbers from your test. Blindly looking at simulations is really difficult.