I would like to run a Thermal Simulation on a mlti-layer PCB. The PCB has a lot of copper at one end of the board and little copper at the opposite end. The amount of copper also varies between layers.
I it possible to represent this type of structure in Flow SImulation?
1. determine a bulk modulus by hand based on layers and copper coverage
2. use the electronics module to do this
for your PCB, in addition to that, i'd probably create a multibody part where i create bodies that i apply different materials to different sections. so the majority of your PCB will have what i describe above, and then some bodies floating in it that are all copper