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Unexpected Thermal Results

Question asked by Chuck Webb on Mar 18, 2013
Latest reply on Mar 19, 2013 by Chuck Webb

system is a follows:

 

Electrical components producing X Watts are bonded to a thermal pad which is bonded to a heat sink which is bonded to a chassis and part of the chassis has a known temp.

 

I ran 2 simulations. One used a thermal pad with a conductance of 6 W/m-K and one with 3 W/m-K.

 

I am getting consistantly lower component temperatures with the less conductive thermal pad! (45deg vs 44deg).

 

Anyone know why this might be?

 

Thank you

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