system is a follows:
Electrical components producing X Watts are bonded to a thermal pad which is bonded to a heat sink which is bonded to a chassis and part of the chassis has a known temp.
I ran 2 simulations. One used a thermal pad with a conductance of 6 W/m-K and one with 3 W/m-K.
I am getting consistantly lower component temperatures with the less conductive thermal pad! (45deg vs 44deg).
Anyone know why this might be?