Hi,
I'm studying a structure that is supposed to hold some mechanical parts (represented by forces on the split lines). These mechanical parts undergo a thermal treatment, and therefore all the structure and the parts are subject to a 1000 °C temperature.
I'm representing this condition with a 1000 °C temperature load.
This is a pic of the structure:
I'm getting odd results, it looks like the effect of thermal expansion is cancelling out bending due to the load exerted by the parts. This is the displacement plot:
Is this the correct method of simulating this structure ?
Also, the final aim of my analysis is determining wether this high temperature will cause problems to my structure. I know a variation of the young's modulus vs temeprature, but I think that a descrease in the young's modulus won't affect my stress (check this link for reference):
http://www.researchgate.net/post/Effect_of_Youngs_Modulus_in_Linear_Analysis_in_ANSYS?exp_tc=tprc
Can linear analysis handle this kind of problem ?
I'm attaching also the solidworks file.
Thanks,
Alex