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Drop Test Analysis of Electronic Unit and Box within a Box

Question asked by David Maxham on Nov 2, 2011
Latest reply on Nov 11, 2011 by Jerry Steiger

We use Solidworks Simulation for random vibration of our designs, but the idea came up of using the software for drop test analysis.  We have all the add-on simulation packages, including Solidworks Simulation Professional that can do drop test analysis of the unit, we've designed,  but what we're looking to do is model the unit within its shipping container.  The container is actually a cardboard box within another cardboard box, and there are two layers of dense foam - one layer in the first box that surrounds the electronic unit and then another layer that is between the internal box and the exterior box.  Each foam layer is about 2 inches thick.

 

Any ideas on how this could be modeled with Solidworks Simulation?  Has it been done before and if so, is there any reference material, etc that I could get?

 

Thanks,  Dave

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