I have been attempting, with little success, to produce a thermal model of a electronic assembly that is housed within a sealed box. For example.....Components radiating heat into the chassis & enclosure and the chassis transferring heat into the enclosure.
What I have is a few components (Heat Power loaded) on a aluminium chassis (Convection load) that perform as expected after meshing/performing a thermal analysis. My problem arises when I enclose this assembly within a sealed enclosure.
So far all studies/tutorials I've found relate to an 'open' enclosure with forced air cooling. Can anyone point me in the direction of a tutorial/some help that may help with this.
Thanks in advance,