I would like to simulate an enclosure that is sealed with a soldered on lid. The goal of the study is to determine the pressure required to yield the solder bond between the lid and enclosure, breaking the seal. I modeled 3 parts, Enclosure (Brass), Solder (Indium), and Lid (Brass). How should I go about modeling the bond between these three materials and simulate when the solder yields?
I have access to Solidworks Premium and Simulation