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Simulating Solder Seal of a Pressurized Enclosure

Question asked by Austin Wulf on Aug 17, 2020
Latest reply on Aug 18, 2020 by Wayne Matus

I would like to simulate an enclosure that is sealed with a soldered on lid. The goal of the study is to determine the pressure required to yield the solder bond between the lid and enclosure, breaking the seal. I modeled 3 parts, Enclosure (Brass), Solder (Indium), and Lid (Brass). How should I go about modeling the bond between these three materials and simulate when the solder yields?

I have access to Solidworks Premium and Simulation 

 

Thank you. 

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