Under the cswpa mold making certification exam, one of the topics that we need to know is the "mold cooling problem" as shown below.

From what I searched, mold cooling is done by using water and coolant to keep the mold temperature optimum. I see a lot of Solidworks simulation on this topic, however, I don't expect to learn simulation for the cswpa-mm exam.

What I believe is that we may simply need to apply a scaling factor to the mold to account for thermal expansion. Not sure if this is correct or there's something else that I need to understand under this topic. Thanks!