Should I create a Computational domain for my air sealed enclosure( houses PCB, Fans and other electronics ). How should I calculate temperature & also cooling effect inside the enclosure. Should I do thermal analysis or use electronic cooling module

I am planning to create an air sealed enclosure( contains PCB and other electronic circuitry) for an application I am working on. How should the computational domain be modeled for CFD. Also I dont know if I should be using Electronics cooling module or thermal simulation to know the temperature inside  as well as how to cool it. Much help appreciated

Message was edited by: Prashanth Kumar Yeddula