I am using Flow Simulation to model a thermoelectric cooler. I have a TEC with an aluminum plate on the "cold" side and an aluminum heat sink on the "hot" side. I got it to run steady state, but when I went back to add an 80W/°C thermal joint on each side of the TEC, I got nothing.
I read that you need to have solids contacting both sides of the TEC, which is what I have, I just added a thermal joint between the TEC/aluminum interfaces. Is this allowed?
Also, has anyone ever tried to run a transient analysis with a TEC?
Any Flow Simulation folks out there can help me out with this?
I am also wondering if I can add multiple tables at different currents instead of just parameters at "maximums". When I run the Flow Simulation at current values less than maximum (1.5A instead of 6.1A), the results seem to be much better than the manufacturer's TEC data sheet describes, adn what I measure on my actual test hardware.