I have a mpcb from top to down:
heat source
copper track
0,1mm dielectric polymer (0,2W/mk)
1,5 mm thickness aluminum
the manufacturer says is an equivalent to 2W/mk but I don't think is a realistic Simulation.
How usually you simulate the MPCB? do you consider every layer ?
the Interface resistance of the polymer is easy to simulate with the relative function, but I cannot put two interface thermal resistance one on top other for the copper track.
How usually you do it?
Model the MCPCB in two parts. First extrusion is for the copper and dielectric use the values in the table's gray-shaded area (in-plane and through plane) below to assign material properties, and second extrusion (un-tick Merge results) is for the aluminum sheet.
The table below is for one copper layer 80% fill and 7 x 10^-5 m thick. If you have more than one copper layer let me know and will recalculate. This calculator is part of the electronics cooling module. Not sure is Flow Simulation will support non-isotropic materials with out electronics module.
The through place resistance With the aluminum-core will be essentially the same value because the aluminum-core offers little resistance compared to the dielectric (factor of 1000 difference in conductivity).
This table for one copper layer and dielectric (MC not included) (the Comments "2 Signal, Alu core" is not correct)