I am trying to model a TO-247 transistor on a heat sink.
The data sheet gives :
Thermal Resistance from Junction to Case 0.27 °C/W
Thermal Resistance from Junction to Ambient 40 °C/W... and no other information about materials (case, chip, bonding material, thermal pad, connection pads).
After searching a little bit on the internet I can make the following hypothesis :
1. case - epoxy resin
2. chip - SIC (4H-SiC, or 6H-Si-C)
3. Thermal pad - cooper
4. Connection pads -cooper
For the bonding material I have no idea...so the only way to define it should be through a contact resistance between the case and the junction....
If I choose to use material/thickness definition I have to approximate chip material&thickness.. so I do not know if it will be accurate.
The problem is that I do not know how to convert the RTH junction to case given by the manufacturer data sheet (°C/W) and the Contact resistance required in SW Flow simulation which is in K*m^2/W ...
Can anyone help me ?