I'm currently doing my master thesis and trying to do a thermal analysis on electronic equipment in SolidWorks Flow Simulation environment. I'm having problems figuring out how to put the default wall thermal conditions and boundary conditions if the electronic appliance have no fans and is air/watertight, as it has an IP-classification. I want to test how it heats up due to heat dissipation from the electrical components inside, in an environment with 23 degrees celsius ambient temp still air.
Any clues, since the tutorials only speak about fans and forced convection? The encasing of the equipment is PC ABS with a cooling aluminium backplate.
Any discussion or suggestion is highly welcomed!