I know this isnt a Solidworks question but I also know there are a lot of knowledgeable people on this website that might can provide me with any answer that I have not yet been able to find. My question is this when choosing a thermal gap pad for a discrete electronic circuit/CPU/IC what percent deflection should be used? It seems to me that the more deflection/force put upon the gap pad yes the more contact you are making with component therfore increasing the thermal conductivity, but eventually doesnt that increase thermal resistance? If I am wrong is the only reason for higher compression deflection is to get the gap pad to conform to more add profiles that might be present in the IC's. Thanks in advance for any help on this .