We want to use FEM to simulate the heat dissipation of plastic encapsulated PCB. The encapsulated molding material need remove the components soldered on PCB. The tooling "Combine" is not working on this assemble level. "Intersec" seems the properly tool per some Youtube videos. However I could not success for the attached one.
Please advice what is the issue on my assemble? or maybe I should use some other tooling, for example "Mold - Cavity"? How to do it? Great thanks for any comments.