Hi everybody,

I am using Floefd to simulate a thermal analysis of a PCB mounted in an electronic equipment. 
The PCB hosts on the surface some components with proper dissipations
Each component is in contact with a mechanical interface to dissipate heat.

I have modeled the PCB into three different ways:

1. PCB modeled as a ''Printed Circuit Board''
2. PCB modeled as a ''Layered''          (EDA IMPORT option)

3. PCB modeled